Modeling of 300 GHz Chip-to-Chip Wireless Channels in Metal Enclosures

Abstract

This paper proposes a two dimensional (2-D) statistical channel model for Terahertz (THz) chip-to-chip wireless communication in desktop size metal enclosures. This model differs from traditional statistical channel models as it models both traveling and resonant waves that exist inside metal enclosures. Based on the cavity environment and the statistical properties of the channel inside the metal cavity, the geometrical model which describes propagation in resonant cavity as a superposition of LoS, single bounced (SB), double bounced (DB), and multi-bounced (MB) rays is proposed. Based on the geometrical model, a parametric reference model is proposed. Furthermore, the path loss model that captures signal strength variation in a resonant cavity is proposed. Frequency correlation functions (FCF) and power delay profiles (PDP) for different possible chip-to-chip communication scenarios are derived and compared with the measured ones. The results show a good agreement between the simulated and measured statistics.