Abstract
AbstractA thermal‐elastic‐viscoplastic model suitable for modeling aluminum nitride (AlN) during crystal growth is presented. A crystal plasticity model that considers slip along crystallographic slip systems and the evolution of mobile and immobile dislocations on the prismatic and basal slip systems is developed. The model has been implemented into a finite element framework, and a sublimation growth process is modeled to demonstrate the model capability. The dislocation density, which characterizes the crystal quality, and the maximum tensile stress on the cleavage planes (m ‐planes), which leads to cracking, are computed. (© 2015 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)
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