Abstract
Copper nanohardness and etch rate measurements in various CMP solutions, in addition to alumina agglomerate size distribution measurements, were used in a model to predict material removal rates (MRR). Model predictions were compared to experimental copper CMP data. In general, the model predictions improved using measured nanohardness compared to predictions using a constant nanohardness of metallic copper. The model reasonably predicts MRR, indicating this model is applicable to the copper CMP process. However, when the solution pH was low (<4) the model overpredicted MRR, possibly due to a thin, hard passivation layer. Also, the model was very sensitive to the surface hardness in solutions of glycine and H2O2.
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