Abstract
AbstractThis paper presents a summary of a quantitative method for evaluating the EMI generation mechanism of a printed circuit board (PCB). First, mismatch of the degree of imbalance of transmission systems on a PCB is pointed out as a common‐mode generation mechanism of high‐speed signal systems. An EMI prediction method based on two‐dimensional analysis is presented along with its results. Next, with regard to the analysis of EMI generation by resonance of the power supply system in a multilayered PCB, a high‐speed simulation by an analytical method and its further extension are described. Finally, a linear macro model (LECCS model) for the device power supply proposed by the author for EMI analysis is presented. © 2004 Wiley Periodicals, Inc. Electron Comm Jpn Pt 1, 87(8): 38–46, 2004; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/ecja.10189
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