Abstract
A simulated model consists of chip-on-board (COB) packaged light emitting diode (LED) array with silicon resin based optical component was built. The principle of the simulation was to investigate the roles of optical component feature play in light extraction efficiency (LEE) by adjusting shape and size of the component to obtain maximum optical output power. Since cylinder resin based optical component is commonly seen in COB packaged LED product, such geometry was chosen and optimized in the simulation. In addition, micro lens array was applied to further improve the performance and it has been found that such design is an effective approach to improve LEE of LED.
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