Abstract
This paper presents some results achieved in the ultra-precision manufacturing, microelectronics engineering, as well as bioengineering applications of vibration-assisted swing cutting (VASC) technology, and describes the resolved and unresolved challenges presented by VASC manufacturing. In particular, it outlines the residual-height between adjacent trajectories in EVC process technology cannot be eliminated, which has the effect of alleviating this problem. Based on matrix-based compliance modeling, the stroke of the PZTs and the allowable stress of the material on the work-space were analyzed. Theoretical modeling was validated by finite element analysis (FEA). The results showed that the max-stroke of the PZTs and the Von Mises stress could reach up to 16.67 μm and 196.6 MPa in the theoretical, respectively. The max-stroke of the PZTs and the Von Mises stress could reach up to 19.50 μm and 158.9 MPa in the finite element analysis, respectively. Cutting experiment was carried out on the basis of VASC design and modeling, which further verified the large work-space and the VASC technology can suppress residual-height between adjacent trajectories effectively. Thus, the superior performances and easily achievable high surface machining accuracy well facilitate practical applications of the VASC system in micro-/nano machining.
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