Modeling and investigation of minimum chip thickness for silicon carbide during quasi-intermittent vibration–assisted swing cutting

Abstract

In micromachining, the quasi-intermittent vibration—assisted swing cutting technology alleviates the residual height problem of elliptical vibration–assisted cutting (EVC) and inherits its intermittent machining characteristics. The minimum chip thickness has a significant impact on cutting forces, tool wear, and process stability when working with difficult-to-machine materials. This study thoroughly examines the impact of cutting parameters and tool parameters on the quality of the workpiece during machining in order to better understand the time-varying characteristics of the quasi-intermittent vibration–assisted swing cutting (QVASC) machining process and the size effect on micro-cutting of silicon carbide crystal. This paper created the minimum chip thickness prediction model suited to QVASC machining process. The effects of variables such as cutting velocity and tool inclination on the minimum chip thickness were discussed as well as the scribing tests that were conducted on such challenging materials as silicon carbide. The research findings shown that during the machining process, the critical undeformed chip thickness of silicon carbide decreased continuously as the cutting velocity sequentially increased (1.51 mm/min, 1.88 mm/min, 2.26 mm/min); under the down inclination angle (0–10°), the critical undeformed chip thickness also continuously decreased. These results confirm that cutting too fast reduces the instantaneous undeformed chip thickness, which is not conducive to ductile removal.