Modeling and Analysis of Thermal Flexure Actuator Using COMSOL Multiphysics

Abstract

Thermal actuators are extensively used in microelectromechanical systems (MEMS). Heat transfer through and around these microstructures are very complex. Knowing and controlling them in order to improve the performance of the micro-actuator, is currently a great challenge. This paper deals with this topic and proposes a dynamic thermal modeling of thermal micro-actuators. Actuator deflection is computed based on elastic analysis of structures. The model predicts the performance of a polysilicon thermal flexure actuator has been developed. The thermal actuators are designed using Thermal stress in Structural mechanics of COMSOL Multiphysics 4.3. The result of modulation and analysis shows the better displacement for the temperature ranges. Actuator deflection is computed based on elastic analysis of structures. Varying the applied voltage and geometrical dimension gives a clear understanding about the performance of the structure.