Abstract
This work presents the electro-thermal analysis of crosstalk effects in pristine (undoped) and intercalation doped multilayer graphene nanoribbon interconnects (MLGNRs). A temperature dependent distributed $T-$ network model of MLGNR interconnects has been developed for analyzing the crosstalk induced effects. Further, a temperature-aware gate oxide reliability model has been proposed to compute the crosstalk induced overshoot/undershoot impact on ultra-thin gate oxide for CMOS devices in terms of failure-in-time (FIT) for side-contact (SC) pristine as well as top-contact (TC) Arsenic pentafluoride ( $AsF_{5}$ ), Ferric chloride ( $FeCl_{3}$ ) and Lithium ( $Li$ ) intercalation doped and undoped MLGNR interconnects. Subsequently, comparisons with $Cu$ -based interconnects are made over a range of chip operating temperature from 233K to 450K.
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