Abstract
This paper proposes an analytical model for computing the highest temperature based on the Fermat point in chips. The transient temperature is determined through the heat source method based on the Fourier transform. Thermal accumulation at the Fermat point in chips of heat sources with identical powers is proposed based on the thermal path, and the expression of the highest temperature solved here can be applied in multiple hot spots with different powers in chips. The results compared with the finite element simulations show that the proposed model can offer an accurate solution to rapidly compute the highest temperature in the representative chips. The temperature of the Fermat point can be estimated to predict the highest temperature of the chip.
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