Abstract
Abstract Selective soldering is the process of soldering components to printed circuit boards that could not be treated in a reflow oven in a traditional surface-mount technology process due to thermal shock and damaging. Process of flux appliance as a first step of the selective soldering process sets the baseline for achieving high quality and robustness of the soldered joints. Purpose of this research is to identify the factors that directly influence the effectiveness of the fluxing process in selective soldering machines, using the design of experiment methodology with associated factors and levels used in the experiment. Final findings gives directions for set up of the optimal fluxing parameters that will enable appropriate flux appliance and to gain reduction of soldering quality issues which foundations are from this process.
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