Abstract
A physical geometric model of the dynamic growth of thermally grown oxide (TGO) was established based on an analysis of the TGO growth of 8YSZ thermal barrier coatings during thermal cycling. Finite-element simulation was used to simulate the evolution law between the coating residual stress and thermal cycling, and the linear elasticity, creep effect, and stress accumulation in each thermal cycle were studied. The interface between the top coat (TC) and the bond coat (BC) was covered with a TGO layer that grew vertically and slowly in a layer-like manner. The stress in the TGO was distributed with a “layer” zonal gradient, and the TGO/BC boundaries were distributed uniformly with a large compressive stress, which decreased the TGO layer thickening. With the longitudinal rapid random TGO growth, the boundaries were subjected to a tensile stress, and a high tensile stress concentration area developed at the boundaries. The internal stress consisted of an alternating and mixed distribution of concentrated compressive and tensile stresses. The concentration area of the maximum equivalent stress was distributed in the one-layer TGO near the TC/TGO interface. When a microcrack formed at the TGO/BC boundaries, the crack was subjected to a tensile stress of different size, with a higher tensile stress at both ends, which facilitated crack expansion. Thus, the 8YSZ thermal barrier coating was prone to crack formation and expansion at the TGO/BC boundaries and in the TGO layer near the TC/TGO boundaries.
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