Abstract
This paper presents an on-chip 13 bits 10 M/S Analog to Digital Converter (ADC) specifically designed for infrared bolometric image sensor. Bolometric infrared sensors are MEMs based thermal sensors, which covers a large spectrum of infrared applications, ranging from night vision to predictive industrial maintenance and medical imaging. With the current move towards submicron technologies, the demand for more integrated, smarter sensors and microsystems has dramatically increased. This trend has strengthened the need of on-chip ADC as the interface between the analog core and the digital processing electronic. However designing an on-chip ADC dedicated to focal plane array raises many questions about its architecture and its performance requirements. To take into account those specific needs, a high level model has been developed prior to the actual design. In this paper, we present the trade-offs of ADC design linked to infrared key performance parameters and bolometric technology detection method. The original development scheme, based on system level modeling, is also discussed. Finally we present the actual design and the measured performances.
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