Abstract
The crack-tip displacement field and molecular dynamics finite element method with Tersoff potentials were used to find the mode-I stress intensity factors (SIF) of silicene, aluminum nitride (AlN), and silicon carbide (SiC) hexagonal sheets. Fracture properties of graphene and boronitrene are also included for comparison. It is found that KIct (KIc is mode-I critical SIF and t is the sheet’s thickness) of silicene, AlN, and SiC sheets are approximately 80, 66, and 47%; and 73, 64, and 45% smaller values of those of graphene for crack along the armchair and zigzag directions, respectively. The estimated fracture toughness of silicene is close to the experimental data of single-crystal silicon.
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