Mode I Delamination Testing of REBCO Coated Conductors via Climbing Drum Peel Test

Abstract

The mode I interface fracture energy for a selection of commercial coated conductors was determined using a climbing drum peel test. Coated conductors with different Ag and copper stabilizer thicknesses were examined. The hypothesis that larger stabilizer thicknesses would result in increased interface fracture energy was broadly confirmed. The location of the fracture in the substrate-buffer-HTS stack was variable. For low stabilizer thicknesses the interface fracture energy was consistent with expected values of the intrinsic G 0 for ceramic layers.