Abstract
As global demand for high-efficiency automotive electronics grows, enhanced heat dissipation and reliability are essential to meet the energy demands of high-computation applications. Void formation in solder joints poses significant challenges, reducing thermal conductivity and joint strength. In response, this study optimizes the vacuum reflow process parameters and stencil aperture design to mitigate voids in Quad Flat No-Lead (QFN) packages, which are widely adopted for their heat dissipation capabilities.Using the Taguchi method, we determined the optimal stencil aperture shapes and reflow conditions for two thermal pad sizes in QFNs. For the large thermal pad (5.24 mm × 4.5 mm), the optimal parameters included a fence-type aperture covering 85 % of the pad area, vacuum pressure of 50 mbar, 10-s vacuum duration, and a fully open vacuum valve. For the small thermal pad (1.6 mm × 4.2 mm), optimal parameters were a fully covered aperture at 85 % of the pad area, 50 mbar vacuum pressure, 5-s vacuum duration, and fully open valve. Results demonstrated that these optimized conditions effectively reduced void ratios to 0.7 % for the large pad and 0.5 % for the small pad, meeting industry standards for automotive applications.
Published Version
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