Abstract
AbstractHigh-resolution electron microscopy -is used to characterize the defect structure of CdTe/GaAs and ZnTe/GaAs heterojunctions before and after annealing. For as-deposited films, a variety of defects exist both in the form of perfect misfit dislocations at the interface and extended defects into the thin film. The extended defects result from dissociation of 60° dislocations and reactions between perfect and partial dislocations lying on intersecting slip planes. The annealed interfaces consist of a periodic array of perfect edge Lomer dislocations, the most efficient type of misfit dislocation for accomodating the lattice mismatch, 14.6 % for CdTe/GaAs and 8 % for ZnTe/GaAs. In both cases, the spacing between dislocations corresponds to the value predicted for completely strain-free thin fims, 31 and 54 Å for CdTe and ZnTe respectively. This paper concentrates on the different dislocation reactions which transform the interfacial structure from the as-deposited case to the annealed case.
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