Abstract

We have measured the minority carrier lifetime τmin in liquid phase epitaxial GaP material grown for high-temperature device applications, as a function of doping concentration, temperature, and epitaxial layer thickness. In p-type GaP doped with Mg, τmin remains constant with increasing carrier concentration until p≊1018 cm−3, where it decreases rapidly. For nominally undoped n-type material we find that τmin increases by nearly one order of magnitude over the temperature range T = 22–600 °C. The apparent lifetimes in these thin-layer materials increase with layer thickness indicating that surface and interface recombination are important.

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