Abstract
A high-performance multicrystalline silicon (mc-Si) ingot was produced by seed-assisted directional solidification, and the minority carrier lifetime of the periphery edge region was evaluated. The defects and impurities in the periphery edge region of the silicon wafers were systematically studied with photoluminescence (PL) imaging, minority carrier lifetime mapping, and Fourier transform infrared (FTIR) spectroscopy. Their relationships with the minority carrier lifetime were investigated. The concentration of substitutional carbon, interstitial oxygen, and dislocation clusters is not directly correlated with the low minority carrier lifetime of the edge zone of the mc-Si ingot. Inhomogeneous grain size distribution and contamination with iron impurities were demonstrated to be the main factors affecting the low minority carrier lifetime. By controlling the impurities and improving the grain size distribution, a modified furnace was designed and a higher-quality mc-Si ingot was manufactured.
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