Abstract
Increase in the minimum film-boiling quench temperature, TMFB, is achieved with microstructured CuO particles, and attributed to local cooling (fin effect) by the microstructure causing liquid–solid contact. A periodic structure is obtained using electrochemical deposition of 1 μm diameter particles on brass sphere diameter 15 mm forming unit-cell porous cones of average height L = 100 μm and base diameter D = 20 μm. Fin analysis predicts the cone tip cooling to the homogeneous nucleation temperature of water (∼330 °C), while the base temperature is at 600 °C. This causes liquid–solid contact during quenching, and analysis suggests the fin effective thermal conductivity ⟨k⟩ and fin characteristic length L2/D are key to this liquid–solid contact that influences TMFB.
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