Abstract
In this paper, a novel technological solution using both silicon surface micromachining and thick polymer layer deposition on low resistivity silicon substrate (20 /spl Omega//cm) has been investigated. The proposed structure achieves both a low attenuation level and a high quality factor. The silicon etching into the coplanar slots leads indeed to a noticeable decrease of the losses, whereas filling the gaps with the polymer BCB avoids a degradation of the effective permittivity.
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