Minimally invasive endoscopic resection of the submandibular gland: A new approach

Abstract

This study evaluates the benefits of a new approach, endoscopic resection of the submandibular gland through the hyoid midline level skin incision by use of an ultrasonically activated scalpel. Twelve operations for patients presenting with submandibular gland disease were performed via minimally invasive endoscopic resection by a single surgeon (M-KC). All 12 submandibular gland resections were successfully performed endoscopically, and no conversions to conventional open resection were necessary. Of the 12 patients who underwent excision, 3, 6, and 3 had mixed tumor, sialoadenitis with sialolithiasis, and chronic sialoadenitis, respectively. The procedures lasted 50 to 125 minutes (median duration, 70 minutes). No complications associated with the operation occurred, and the scar was almost invisible because of its concealed location with the neck in the natural position. Endoscopic resection of the submandibular gland is a feasible method for treatment of benign lesions. The main advantages of this procedure are that the small operative scar is concealed in the submental skin crease, resulting in improved cosmetic results and minimization of the possibility of facial nerve injury.