Abstract
Based on Through-Silicon Via (TSV) technology, a Substrate Integrated Waveguide (SIW) bandpass filter with ultra-compact size is presented for sixth-generation (6G) mobile communication applications. The proposed filter is proposed by the way of the generalized Chebyshev filters and coupling matrix reconfiguration. The measurement results reveal that the out-of-band rejection is better than 25 dB with frequencies up to 1.059 f0. In addition, the proposed filter has the center frequency of the passband at 0.371 THz with bandwidth of 0.0183 THz. The size is only 0.496 × 0.33 mm2.
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