Abstract

This paper reports the development of a novel InSb photovoltaic infrared sensor (InSb PVS) operating at room temperature. The InSb PVS consists of an InSb p<sup>+</sup>/p<sup>-</sup>/n<sup>+</sup> structure grown on semi-insulating GaAs (100) substrate, with a p<sup>+</sup> Al<sub>0.17</sub>In<sub>0.83</sub>Sb barrier layer between p<sup>+</sup> and p<sup>-</sup> layers to reduce diffusion of photo-excited electrons. Photodiodes were fabricated by wet etching process and, using a 500K blackbody, we obtained D* of 2.8x10<sup>8</sup> cmHz<sup>1/2</sup>/W and R<sub>V</sub> of 1.9 kV/W at room temperature. S/N was improved with the serial connection of 700 photodiodes patterned on a 600x600 &#956;m<sup>2</sup> chip. Increasing the number (N) of connected photodiodes, S/N ratio was improved by a factor of N<sup>1/2</sup>. RV was constant for signals ranging from DC to 500Hz. From spectral response measurements a cut-off wavelength of 6.8 &#956;m was obtained. The InSb PVS was flip-chip bonded on a pre-amplifier IC, allowing the shortest connection between the InSb PVS and the pre-amplifier, making the system immune to electromagnetic noise. The system was finally encapsulated by a Dual Flat Non-leaded (DFN) package with a window, which exposes the backside of the GaAs substrate allowing the infrared light incidence. The device external sizes are 2.2 mm x 2.7 mm x 0.7 mm and to our knowledge is the smallest uncooled sensor for the middle-infrared range reported until now.

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