Abstract
This paper presents an analog front-end transceiver for an ultrasound imaging system based on a high-voltage (HV) transmitter, a low-noise front-end amplifier (RX), and a complementary-metal-oxide-semiconductor, aluminum nitride, piezoelectric micromachined ultrasonic transducer (CMOS-AlN-PMUT). The system was designed using the 0.13-μm Silterra CMOS process and the MEMS-on-CMOS platform, which allowed for the implementation of an AlN PMUT on top of the CMOS-integrated circuit. The HV transmitter drives a column of six 80-μm-square PMUTs excited with 32 V in order to generate enough acoustic pressure at a 2.1-mm axial distance. On the reception side, another six 80-μm-square PMUT columns convert the received echo into an electric charge that is amplified by the receiver front-end amplifier. A comparative analysis between a voltage front-end amplifier (VA) based on capacitive integration and a charge-sensitive front-end amplifier (CSA) is presented. Electrical and acoustic experiments successfully demonstrated the functionality of the designed low-power analog front-end circuitry, which outperformed a state-of-the art front-end application-specific integrated circuit (ASIC) in terms of power consumption, noise performance, and area.
Highlights
Ultrasound, since it was discovered, has been a widely used tool for multiple applications such as medical echography and nondestructive testing
Volumetric medical imaging [1], in vivo and in vitro neuromodulation ultrasound [2], fingerprint sensing [3], and gesture recognition [4] are some new applications based on micromachined ultrasound transducers (MUTs)
Two different micromachined ultrasound transducers can be found in the literature [5]: the first one is based on a capacitive resonant element (CMUT) that consists of a thin metallized suspended membrane over a cavity with a rigid metallized substrate
Summary
Ultrasound, since it was discovered, has been a widely used tool for multiple applications such as medical echography and nondestructive testing. Today the ultrasound sensing market is showing an impressive resurgence: new applications along with improved manufacturing capabilities and advanced technological readiness are driving the growth of micromachined ultrasound transducers (MUTs). Volumetric medical imaging [1], in vivo and in vitro neuromodulation ultrasound [2], fingerprint sensing [3], and gesture recognition [4] are some new applications based on MUTs. Nowadays, two different micromachined ultrasound transducers can be found in the literature [5]: the first one is based on a capacitive resonant element (CMUT) that consists of a thin metallized suspended membrane over a cavity with a rigid metallized substrate. An ultrasound can be generated in the surrounding medium from the vibration of the membrane when AC voltage is imposed. The second transducer is based on piezoelectric materials (PMUTs), in which (in contrast to CMUTs) the deflection of the membrane is produced by the lateral strain generated from a piezoelectric actuation, whereby the membrane
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