Abstract
The design and measurement of a 10 GHz miniaturised branch-line coupler using thick-film photoimageable materials is presented. This attempts to reduce passive component size by demonstrating thin-film microstrip (TFMS)-based structures with a thick film processing technology. This technique offers a cheaper and faster way to implement compact multilayer circuits compared to thin-film technology. The fabricated hybrid of intrinsic area 1.19 × 1.07 mm demonstrates excellent performance and the measurements are in good agreement with the simulations.
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