Abstract
The versatility of hot embossing for shaping photonic components on-chip for mid-infrared (IR) integrated optics, using a hard mold, is demonstrated. Hot embossing via fiber-on-glass (FOG), thermally evaporated films, and radio frequency (RF)-sputtered films on glass are described. Mixed approaches of combined plasma etching and hot embossing increase the versatility still further for engineering optical circuits on a single platform. Application of these methodologies for fabricating molecular-sensing devices on-chip is discussed with a view to biomedical sensing. Future prospects for using photonic integration for the new field of mid-IR molecular sensing are appraised. Also, common methods of measuring waveguide optical loss are critically compared, regarding their susceptibility to artifacts which tend artificially to depress, or enhance, the waveguide optical loss.
Highlights
The mid-infrared (IR) part of the electromagnetic spectrum spans 3- to 25-μm wavelength and encompasses the fundamental vibrational absorption signatures of molecular species.[1]
This paper will review the latter body of work draw overaching conclusions and demonstrate how it is helping to pave the way for miniaturization of photonic chip devices for rapid and inexpensive scale-up of manufacture
This paper has demonstrated that low optical loss, mid-IR chalcogenide-glass waveguides can be readily fabricated via the hot-embossing technique; the processing is fast, scalable, and obviates the need for expensive equipment
Summary
The mid-infrared (IR) part of the electromagnetic spectrum spans 3- to 25-μm wavelength and encompasses the fundamental vibrational absorption signatures of molecular species.[1]. This is made possible because chalcogenide glasses are readily shaped and patterned above their glass transition (Tg) and, on cooling below Tg, the shaping and patterning are frozen-in In this way, passive monomode rib waveguides of high numerical aperture (NA) have been demonstrated using hot embossing by hard mold with a variety of approaches[19,20,21,22,23] via fiber-on-glass (FOG), thermally evaporated films, and radio frequency (RF)-sputtered films, on glass. This paper will review the latter body of work (for the detailed methodology see the original references 19–24) draw overaching conclusions and demonstrate how it is helping to pave the way for miniaturization of photonic chip devices for rapid and inexpensive scale-up of manufacture These hot embossed chalcogenide glass planar waveguides are not optically over-clad. Common methods of measuring waveguide optical-loss are critically compared, with regard to their susceptibility to artifacts of the measurement approach which may tend artificially to depress, or enhance, the waveguide optical loss
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