Abstract
It is our pleasure to write this column and introduce the <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">IEEE Microwave Magazine</i> reader to this focus issue “Microwave/Millimeter-Wave Packaging for 5G and Beyond.” This focus issue was inspired by past presidents of the IEEE Microwave Theory and Technology Society (MTT-S) as a means to promote the visibility of other IEEE Societies within MTT-S activities. The issue is sponsored by the MTT-S Technical Committee (TC)-16, Microwave and Millimeter-Wave Packaging, Interconnect and Integration. Advanced microwave and millimeter-wave (mm-wave) packaging is a multidisciplinary research area where transdisciplinary innovation is key to enabling the challenging applications of 5G and mm-wave. As a result, in parallel with the MTT-S, several other societies within IEEE are working to address these challenging issues.
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