Microwave curing bismaleimide-triazine composites filled with micro-silica and nano-silica

Abstract

A novel composite of bismaleimide-triazine (BT) resins containing 2,2′-diallyl bisphenol A (DABPA) and filled with the mixture of micro- and nano-silica particles were cured by conventional thermal and microwave-assisted process. The dielectric and mechanical properties of BT composites were studied in this paper. The results indicated that the curing method, particle size and content of silica had influences on the dielectric and mechanical properties of BT composites. The dielectric constant and dielectric loss tangent of microwave-cured samples were lower than those of the thermal cured samples because of the different curing mechanism. With the increase of micro-silica content, the dielectric constant of BT composites increased, while the dielectric loss tangent decreased. Due to the decrease of the free volume, the dielectric constant and dielectric loss tangent decreased when the nano-silica particles were incorporated into the composites. In addition, the flexural strength of the BT composites will also be improved by incorporating appropriate amount of micro- and nano-silica particles.