Abstract
This is part II of a two-part paper on the mechanical behavior of lead-free solders. The durability properties of Sn3.9Ag0.6Cu lead-free alloy are presented and compared to baseline behavior of an eutectic Sn63Pb37 solder. Mechanical cyclic tests are performed over various temperatures, strain rates and stresses using the thermo-mechanical-microstructural (TMM) test system. Analyses using standard power-law durability models based on work, inelastic strain range and normalized displacement range are presented. In addition, an analysis of average crack propagation rate durability model is also presented. It is shown that the baseline SnPb eutectic alloy and the SnAgCu lead-free alloy exhibit mixed durability advantages depending on the test conditions, with a cycles-tofailure crossover in the range of 1000-7000 cycles under high temperature, low strain rate conditions.
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