Microtensile bond strength of self-etching adhesives to enamel

Abstract

Purpose It is uncertain whether single-step self-etching adhesives form bond to enamel as reliable as those of etch-and-rinse adhesives. This study compared the microtensile bond strengths to ground enamel of three one-step self-etching adhesive systems, a self-etching primer system and an etch-and-rinse adhesive system. Materials and methods Human enamel was ground flat with 320-grit silicon carbide paper. The self-etching adhesives Clearfil Tri S Bond (Kuraray), Futurabond NR (Voco) and Hybrid Bond (Sun-Medical), the adhesive with a self-etching primer Clearfil SE Bond (Kuraray) and the etch-and-rinse adhesive Admira Bond (Voco) were applied as directed, followed by a core of the same manufacturers' hybrid resin composite. A microtensile bond strength evaluation was performed after 48 h of water storage, using untrimmed beams ~1.0 ± 0.1 mm2 in cross-sectional area at a cross-head speed of 0.5 mm/min. Results There were no pretest failures in any group, and failures were predominately adhesive or mixed. Adhesion to enamel of Futurabond NR and Clearfil SE Bond was not significantly different from Admira Bond, while Clearfil Tri S Bond and Hybrid Bond demonstrated significantly lower bond strengths (one-way analysis of variance, Tukey–Kramer multiple-comparison test, P Clinical significance Bond strength to ground enamel of self-etching adhesive systems was dependant on the type of adhesive and some materials showed bond strength that was not different than that of etch-and-rinse system.