Abstract
This paper examines the incorporation of both microelectronics and micromachining (termed microtechnologies) as applied to deep space telecommunication subsystems. Using the Pluto Fast Flyby Pre-Project as a main case study we have reduced the subsystem mass by 50%. This was accomplished via the use of advanced packaging {RF and digital multichip modules (MCMs) and Monolithic Microwave Integrated Circuits (MMICs) for the transponder and advanced GaAs power device technology for solid state power amplifiers}. Micromachined diplexers, filters, and switches using membrane-supported transmission line-technology (MIST-T) provide the potential to reduce subsystem form factor. Another way to reduce mission costs is in the use of both 32 GHz (at Goldstone Deep Space Network {DSN} facility) and 8.4 GHz (at Canberra and Madrid DSN facilities) downlink frequencies. This allows the data to be returned faster, thereby saving both DSN and Mission Operation costs.
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