Microstructures evolution and growth kinetics of intermetallic compounds in Cu/Sn/Cu system during ultrasonic soldering process

Abstract

PurposeThis study aims to investigate the effect of ultrasound on interfacial microstructures and growth kinetics of intermetallic compounds (IMCs) at different temperatures.Design/methodology/approachTo investigate the effect of ultrasound on IMCs growth quantitatively, the cross-sectional area of IMCs layers over a confirmed length was obtained for calculating the thickness of the IMCs layer.FindingsThe generation of dimensional difference in normal direction between Cu6Sn5 and its adjacent Cu6Sn5, formation of bossed Cu6Sn5 and non-interfacial Cu6Sn5 in ultrasonic solder joints made the interfacial Cu6Sn5 layer present a non-scallop-like morphology different from that of traditional solder joints. At 260°C and 290°C, the Cu3Sn layer presented a wave-like shape. In contrast, at 320°C, the Cu3Sn in ultrasonic solder joints consisted of non-interfacial Cu3Sn and interfacial Cu3Sn with a branch-like shape. The Cu6Sn5/Cu3Sn boundary and Cu3Sn/Cu interface presented a sawtooth-like shape under the effect of ultrasound. The predominant mechanism of ultrasonic-assisted growth of Cu6Sn5 growth at 260°C, 290°C and 320°C involved the grain boundary diffusion accompanied by grain coarsening. The Cu3Sn growth was controlled by volume diffusion during the ultrasonic soldering process at 260°C and 290°C. The diffusion mechanism of Cu3Sn growth transformed to grain boundary diffusion accompanied by grain coarsening when the ultrasonic soldering temperature was increased to 320°C.Originality/valueThe microstructural evolution and growth kinetics of IMCs in ultrasonically prepared ultrasonic solder joints at different temperatures have rarely been reported in previous studies. In this study, the effect of ultrasound on microstructural evolution and growth kinetics of IMCs was systematically investigated.