Abstract
With the purpose of improving the properties of the Sn–3.8Ag–0.7Cu lead-free solder 0.5 wt% micro-CuZnAl particles were added. The experimental results showed that CuZnAl particles had little effect on the melting characteristics of Sn–3.8Ag–0.7Cu alloy. With the addition of CuZnAl particles, the tensile and shear stresses of solder joints were increased by 21% and 19%, respectively, and the microstructure matrix was refined obviously. However, the spreading area of solder was reduced by 7.2% and 3.6% at 230 °C and 250 °C on Cu substrates, respectively. In addition, the effect of CuZnAl particles on the growth of interfacial IMCs in the structure of Cu/Sn–3.8Ag–0.7Cu/Cu solder joints was studied. The results showed that the addition of 0.5 wt% CuZnAl particles could inhibit the growth of IMCs layer and the formation of voids.
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