Abstract
Microstructures, interface reaction, melting characteristics, tensile property, thermal fatigue behavior and wettability of Sn58Bi, Sn35Bi0.3Ag and Sn35Bi1.0Ag solders were investigated. Only Sn phase and Bi phase like net-type distribute uniformly in the Sn58Bi matrix, Sn35Bi0.3Ag and Sn35Bi1.0Ag solder show the Ag3Sn particles in the Sn matrix around net-like Bi phase, at the solder/Cu solder joints, only Cu6Sn5 intermetallic compound was observed. The liquid phase line temperature of Sn35Bi0.3Ag and Sn35Bi1.0Ag is higher than that of SnBi solder. Sn35Bi1.0Ag solder joints show superiority in mechanical property and fatigue life, which can attribute to the strengthening effect of Ag3Sn particles. Moreover, the wettability of Sn35Bi1.0Ag solder was best of all, and the N2 atmosphere and RMA flux can enhance the wettability obviously, which can provide the reference support of the research of SnBi base solders.
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