Abstract
A Cu-coated C nanofiber (Cu-CNF) composite is added to a Sn-3.5Ag alloy to fabricate a solder nanocomposite using mechanical stirring and a melting technique. The microstructural features of the samples, i.e., the β-Sn grain size and the distribution and thickness of the Ag3Sn intermetallic compound (IMC), are statistically measured. The wettability of the developed solders is tested on a Cu substrate by contact-angle and spreading-factor measurements. The experimental results indicate that the presence of up to 0.05 wt pct Cu-CNFs in the solder matrix reduces the β-Sn secondary dendritic arm spacing significantly. Additionally, the spread ratio and spread factor are improved to 93 and 96 pct, respectively, owing to the adsorption of surface-active CNFs in the solder matrix. Furthermore, the addition of 0.05 wt pct Cu-CNFs to the Sn-Ag (SA) alloy increases the microhardness, tensile strength, elongation percentage (El pct), and toughness by 40, 35, 11, and 33 pct, respectively.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
