Abstract
AbstractThis project aims to assess the influence of cryogenic treatment prior to passing the solder sample through an equal channel angular pressing die in order to refine the microstructure of solder and thus, gain improvement of mechanical properties of solder joint. In this work, commercial tin‐3.0silver‐0.5copper solder alloy was subjected to severe plastic deformation by passing through the die for 1 pass, and prior to this, dipped in nitrogen for 10 minutes, 20 minutes and 30 minutes. Hardness and wettability of solder reflowed on bare copper substrate were measured along with strength of solder joint via lap joint shear strength test. Cryo‐deformed solder was found to have higher hardness, and wettability had also improved along with the strength of solder joint. Improvement could be due to grain refinement as observed in microstructure and also the more uniform distribution of eutectic network. Dipping for 10 minutes gave the best improvement, whereas longer dipping (20 and 30 minutes) seems to have deteriorating effect to the wettability and mechanical properties. Cryo‐deformation showed significant improvement on the wettability and mechanical properties of solder, and could potentially lead to higher reliability of solder joint.
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