Abstract
This Paper Reports the Microstructure, IMC Evaluation and Wettability of Low-Ag Sn-Ag-Cu(SAC) (0.3 Wt% Ag and 0.5 Wt% Ag) and SAC305 Solder Alloys in Reflowed and Agedconditions. Reflow was Done at 250°C and Thermal Aging at 150°C For100 Hours. Microstructure of Bulk Solder and the IMC Formed at Interfacebetween Solder and Cu Substrate were Observed Using SEM Equipped with EDX. Microstructureobservation Showed Finer β-Sn Dendrites at 0.3%Ag Indicating a Possiblerefining Effect of Lower Ag on Bulk Solder Microstructure. SEM Result Showedfiner Ag3Sn Distributed in the Solder but the IMC Thickness of Bothreflowed and Aged Solder Joint Seems to Increase with Decreasing Ag Content.This could be due to Finer β-Sn Dendrites which Provide more Diffusion Paththrough Grain Boundaries and Increase IMC Thickness. Similarly, Lower Ag Content Appears to have Detrimental Effect on Wettability and Wetting Angle Ofsolder Joint.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
