Abstract
The potential of Zn4Al3Mg–xIn alloys to replace Pb-containing solders by high-temperature soldering was studied. The microstructure, thermal behavior, and wettability of Zn4Al3Mg–xIn solders were investigated by scanning electron microscopy, X-ray diffraction, differential scanning calorimetry (DSC), and spreading tests. The influence of In content on the microstructure and characteristics of the solders was explored. Small additions of In result in grain boundary segregation because of the limited solid solubility of In in other phases, and thereby lead to more complicated microstructure of Zn4Al3Mg–xIn alloys. DSC measurements showed that the onset of melting of the Zn4Al3Mg–xIn alloys decreased with increasing In content, while the melting peak became broader. The electrical conductivity values of ZnAlMg–xIn solders were of the same order of magnitude as those of a conventional Pb-5(wt%)Sn solders. The wettability of Zn4Al3Mg–xIn solders over Cu substrate was also improved with increasing In content.
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