Microstructure of External Stress Whiskers and Mechanical Indentation Test Method

Abstract

Lead-free commercial products have been dramatically increasing in the world markets as the restriction of certain hazardous substances (RoHS) directive in the European Union has been enacted. At the same time, the problem of “tin whiskers” has become one of the most serious problems in the industry. Growth of tin whiskers is believed to be related to residual stress inside the tin plating film and external compressive stress. Whiskers in fine-pitch connectors have affected the practical production of advanced digital equipment. The Japan Electronics and Information Technology Industries Association (JEITA) has proposed a new testing method to evaluate tin whiskers, especially for the fine-pitch connectors. This paper describes the microstructures of external stress whiskers and the mechanical indentation test method.