Abstract
Polycrystalline samples of technical-purity Cu (99.95 wt pct) and Cu with 0.18 wt pct Zr have been processed at room temperature by equal-channel angular pressing (ECAP). The microstructure evolution and its fragmentation after ECAP were investigated by transmission electron microscopy (TEM), electron backscattered diffraction (EBSD), positron annihilation spectroscopy (PAS), and by X-ray diffraction (XRD) line-profile analysis. The first two techniques revealed an increase in the fraction of high-angle grain boundaries (HAGBs), with increasing strain reaching the value of 90 pct after eight ECAP passes. The increase was more pronounced for pure Cu samples. The following two kinds of defects were identified in ECAP specimens by PAS: (1) dislocations that represent the dominant kind of defects and (2) small vacancy clusters (so-called microvoids). A detailed XRD line-profile analysis was performed by the analysis of individual peaks and by total profile fitting. A slight increase in the dislocation density with the number of ECAP passes agreed with the PAS results. Variations in microstructural features obtained by TEM and EBSD can be related to the changes in the XRD line-broadening anisotropy and dislocation-correlation parameter.
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