Abstract
The evolution in microstructure of Sn-Cu based solder paste with different copper (Cu) content subjected to multiple reflow cycles was investigated. In this study, the Sn-0.7Cu (SC) solder paste was used as based material. The Cu particles were added into SC solder paste to produce new Sn-4Cu and Sn-10Cu solder paste. After that, the solder paste was then reflowed on Cu-OSP surface finished and subjected to six times reflows. Characterization focuses on the bulk solder microstructure, morphology and intermetallic compound (IMC) thickness after multiple reflows. Results reveal that solder composition significantly affect the microstructure formation and growth of IMC.
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