Abstract
Ultrasonic-induced transient liquid phase bonding of Mg/Cu dissimilar alloys with Zn interlayer was carried out. The effects of pressure and temperature on the microstructure and mechanical properties of the weld seam were investigated. The formation of the MgZn solid-liquid interface, α-Mg solid solution spalling and merging growth behavior were analyzed. With the increase of pressure, the interface metallurgical reaction between the base metal and the interlayer was intensified, and the width of the weld seam decreased gradually. Solid solution, MgZn, MgCu, CuZn, and CuMgZn intermetallic compounds in the weld seam were detected. The fine granular eutectic structure has a tendency to transform into a layered eutectic structure gradually. A tendency to merge and grow for the adjacent α-Mg solid solution was observed. CuMgZn formed on the Cu side was embedded on the surface of Cu5Zn8, and remained in the weld seam. The thickness of CuMgZn increased with the increase of temperature. The fracture occurred between CuMgZn and Cu5Zn8, and the fracture manner was a brittle fracture. The highest average strength was 80.75 MPa.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
