Abstract

Rolling enables the directional alignment of the reinforcements in graphene/Cu composites while achieving uniform graphene dispersion and matrix grain refinement. This is expected to achieve a breakthrough in composite performance. In this paper, the process parameters of rolling are investigated, and the defects, thickness variations of graphene and property changes of the composite under different parameters are analyzed. High-temperature rolling is beneficial to avoid the damage of graphene during rolling, and the prepared composites have higher electrical conductivity. The properties of graphene were investigated. Low-temperature rolling is more favorable to the thinning and dispersion of graphene; meanwhile, the relative density of the composites is higher in the low-temperature rolling process. With the increase of rolling deformation, the graphene defects slightly increased and the number of layers decreased. In this paper, the defect states of graphene and the electrical conductivity with different rolling parameters is comprehensively investigated to provide a reference for the rolling process of graphene/copper composites with different demands.

Highlights

  • Cu metals, alloys, and composites are widely used in industrial production

  • Clarify the deformation behavior of graphene in the matrix, this paper comprehensively studied the effects of deformation temperature and rolling deformation on graphene/Cu hensively studied the effectsevolution of deformation temperature and rolling deformation on composites

  • The ID/IG ratio of different total deformations has shown an upward trend from 20% to 80%, indicating that the defects of deformations has shown an upward trend from 20% to 80%, indicating that the defects of graphene are gradually increasing during the rolling process

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Summary

Introduction

Cu has excellent electrical and thermal conductivity, as well as good processability and corrosion resistance, second only to Ag [1,2] They play a vital role in key fields such as electronic packaging, microelectronics industry, national defense, and aerospace [3,4,5]. Graphene nanoplates (GNPs) are used as reinforcements and added to the pure copper metal matrix to prepare GNPs/Cu composites. They can retain the high electrical conductivity and high thermal conductivity of the Cu metal material while having good mechanical properties [11,12]. Graphene/Cu composite has good designability and is expected to be applied in the fields of different structures and functional materials [13,14,15]

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