Microstructure evolution at the interface between Cu and eutectic Sn–Bi alloy with the addition of Ag or Ni

Abstract

The study investigated the growth kinetics and rate-controlling processes of intermetallic layers formed at the interface between Cu and eutectic Sn–Bi alloys with Ag or Ni addition at solid-state temperatures. Isothermal sections of the equilibrium phase diagram were calculated to understand phase stability at the interface. The thicknesses of the intermetallic layers were plotted against annealing time, and a power function equation with an exponent slightly smaller than 0.25 described their relationship, indicating boundary diffusion with grain growth as the predominant control mechanism. The relationship between the exponent and annealing temperature suggested that the grain growth in the intermetallic layer followed an approximate parabolic law. The eutectic microstructure in Sn–57Bi–1Ag and Sn–57Bi–1Ni alloys changed with annealing, with differences in the Bi region width. However, the contact surface area between the Bi region and Cu6Sn5 compound was similar in both alloys. Activation enthalpies for the rate-controlling process of intermetallic layer growth were evaluated, providing insights into the energy barrier for atomic diffusion or transport across the interface.