Abstract
A series of diffusion bonding tests were conducted on high Nb containing TiAl alloy with duplex microstructure, the evolution of microstructure at bonding interface was investigated. Bonding process was performed by using vacuum hot press furnace at the temperature range from 850 to 1150°C with the pressure of 30MPa for 45min. The microstructure observation indicates that sound joint without unbounded area can be obtained when bonded above 950°C. Recrystallization happens in bonding interface when bonded at 1150°C and the recrystallized grain prior nucleated at bonding interface between the lamella colonies. Nucleation and growth of recrystallized grains promote migration of bonding interface and thus improve bonding quality. Besides, the post-bonding heat treatment (PBHT) was also performed to promote the evolution of bonding interface. The experimental results reveal that the bonding interface disappears after PBHT at 1135°Cfor 12h, and exhibits near gamma microstructure.
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