Microstructure, electrical, mechanical and thermal properties of melt-spun bismuth–tin eutectic alloy

Abstract

Microstructure, electrical, mechanical and thermal properties of melt-spun Bi58Sn42 eutectic alloy have been investigated using scanning electron microscopy, X-ray analysis, the double bridge method, dynamic resonance method, Vickers hardness measurement and thermal analysis. The structure and physical properties of this alloy are affected by the preparation method (rapid solidification technique). The bismuth–tin eutectic alloy has good properties as a lead-free solder alloy, such as low melting point and adequate cost and mechanical properties when compared with commercial tin–lead solder alloys.