Abstract
Solders are used as interconnect materials in microelectronic packaging. Traditionally, eutectic and near-eutectic Pb-Sn solder alloys have been used. Due to the toxic nature of lead, environmentally-benign Sn-rich (Pb-free) solders are being developed. In this two part series of articles, we have focused on elucidating the relationship between microstructure and creep behavior of Sn-rich alloys, both in bulk form and at the solder sphere joint level. Part I of our study focuses on a detailed quantitative analysis of the effect of controlled cooling rates on solder microstructures. Bulk solder microstructures from cast bars were compared to smaller solder joint microstructures, reflowed from single solder spheres about 1 mm in diameter. Faster cooling rates resulted in much finer secondary dendrite size and spacing, as well as a much finer distribution of Ag3Sn and Cu6Sn5 particles. The companion article, Part II, provides a unified mechanistic understanding of the creep behavior for the Sn-rich solder alloys, intimately linked to the microstructure characterization work reported in Part I.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
