Abstract
The reduction behaviors of unitary and binary bismuth cation (BiIII), tellurium cation (TeIV) in nitric acid and hydrochloric acid solutions were studied at different acid concentrations. Compared to the nitrate bath, the reduction of BiIII was retarded and the reduction of TeIV was promoted in hydrochloric acid. As a result, the difference in the reduction potential of BiIII and TeIV was markedly reduced in the presence of chloride ion. The acid concentration affected the morphologies of the Bi-Te deposit; specifically a rougher deposit was electroplated at higher acid concentrations. A 25μm Bi2Te3 film obtained from 0.7M HNO3 at −20mV versus saturated calomel electrode (SCE) had columnar structure with (110) preferred orientation and its Seebeck coefficient and power factor were −72.3μV/K and 732μW/m·K2, respectively. A 25μm smooth, compact, nano-grained Bi2Te3 film was fabricated in 0.35M HCl at −20mV versus SCE and its Seebeck coefficient and power factor were −105.0μV/K and 169μW/m·K2, respectively.
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