Microstructure and thermal properties of copper matrix composites reinforced by 3D carbon fiber networks

Abstract

Three-dimensional (3D) carbon fiber (CF) networks were constructed by electrodeposition using Cu foam as template, and then 3D CF/Cu composites were prepared by hot pressing sintering. Experimental investigations revealed the successful formation of a well-connected 3D CF network embedded within the Cu matrix. The constructed 3D CF networks are conducive to establishing effective heat transfer channels in the composites. The thermal conductivity of the 3D CF/Cu composite with 20 vol% CF in the X–Y plane and Z plane are 418 ± 3 Wm−1K−1 and 415 ± 5 Wm−1K−1, respectively. The thermal conductivity of the composites is significantly enhanced, and the thermal conductivity becomes isotropic. Additionally, the construction of the 3D CF network promotes efficient heat transfer in CF/Cu composites, providing a promising strategy for the development of advanced CF/metal thermal management materials.